I was just thinking about the 1871 book Through the Looking-Glass, and What Alice Found There by mathematician, logician, Anglican deacon, writer, and photographer, the Reverend Charles Lutwidge Dodgson (a.k.a. Lewis Carroll).
Lewis Carroll’s Alice’s Adventures in Wonderland and Through the Looking-Glass continue to influence us today, not just as beloved children’s stories … Read More → "Wow! AI-Powered “Sketch-on-Napkin” to Embedded Design"
Efinix has just done designers a solid. The company’s new Ti180J484D1 FPGA incorporates a 2Gbit LPDDR4X SDRAM die co-packaged with the FPGA die, which creates a System in Package (SiP) device that results in a smaller footprint on your circuit board. In addition, you won’t need to worry about the precise pcb trace-length matching that’s required to properly connect the DDR … Read More → "Efinix co-packages FPGA with SDRAM to shrink board-level real estate footprint"
This week’s podcast is all about high speed data transmission in aerospace applications! My podcast guests this week are Christian Hobmaier and Thomas Mittermeier from ODU connectors. Christian, Thomas and I explore the biggest challenges in this arena, the innovative new connector solutions ODU offers to support these kinds of designs, and the details of ODU’s rigorous testing that includes a technique called the “Arizona Dust Test”. … Read More → "Headed to the Skies! High Speed Data Transmission for Aerospace Designs"
