Edge AI Inferencing 5X Faster with 1/2 the Memory (What’s Not to Love?)

There’s an old joke that I remember from when I was a kid. It started when my dad asked, “When is a door not a door?” I looked at him blankly (a look I’ve since perfected over the years) until he came up with the punchline, “When it’s ajar,” at which point he would convulse in mirth. Well, I have one for you, which … Read More → "Edge AI Inferencing 5X Faster with 1/2 the Memory (What’s Not to Love?)"

Smaller, Lighter, Faster Connectors and the Future of Soldier Communication Systems

My podcast guest this week is Craig Kammerman from ODU and we are talking about the next generation of soldier communication systems. We investigate the biggest trends in these kinds of systems today and how ODU’s connector solutions can help solve the challenges inherent in these types of designs. Also this week, I check out a new rocket fuel developed at the University at Albany … Read More → "Smaller, Lighter, Faster Connectors and the Future of Soldier Communication Systems"

Agentic AI Prevents Costly Machine Downtime in Factories and Semiconductor Fabs

Things are moving fast in AI space (where no one can hear you scream). For example, I first became aware of the concept of “Agentic AI” only a couple of months ago as I pen these words. Now, I find that this bodacious beauty is already being deployed in factories and semiconductor fabs to transform manufacturing and prevent costly machine downtimes. I tell you, I’m too … Read More → "Agentic AI Prevents Costly Machine Downtime in Factories and Semiconductor Fabs"

New Auto Test Capability for the Analog Portions of SoCs

Ever since I began my career in electronics, analog has been the underdog compared to digital in the realm of automation. In the case of tools and techniques like fault simulation, test coverage, and automatic test pattern generation, the digital world has enjoyed robust support for decades. Meanwhile, analog has typically been relegated to handcrafted efforts and ad-hoc methods. Well, that imbalance just shifted in a dramatic … Read More → "New Auto Test Capability for the Analog Portions of SoCs"

October 8, 2025
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featured chalk talk

BIOFUSE Tubing – Next Generation Heat Shrink Tubing Innovations
There is a greater demand today for sustainable solutions for electronic design than ever before. In this episode of Chalk Talk, Shane Lauth from TE Connectivity and Amelia Dalton explore the what, where, and how of heat shrink tubing. They also investigate the variety of benefits of TE Connectivity’s BIOFUSE heat shrink tubing and how this solution represents a lower environmental impact while maintaining the same price and performance of other TE Connectivity heat shrink tubing solutions.
Sep 19, 2025
24,805 views

featured paper

The power of shift-left DRC verification with Calibre nmDRC Recon

Sponsored by Siemens Digital Industries Software

Accelerate IC design verification with Siemens’ Calibre nmDRC Recon, reducing runtimes by focusing on local checks earlier in the flow. This approach enhances productivity, simplifies debugging and cuts time-to-market.

Click to read more

Libby's Lab

Libby's Lab Scopes out TE Connectivity E-motor Temperature Sensors

Sponsored by Mouser Electronics and TE Connectivity

Join Libby and Demo in this episode of “Libby’s Lab” as they explore the TE Connectivity e-motor temperature sensors, available at Mouser.com! These temperature sensors are great for a variety of motor-monitoring applications. Keep your circuits charged and your ideas sparking!

Click here for more information about TE Connectivity E-Motor Temperature Sensors

discussion
Posted on Oct 8 at 6:31am by Max Maxfield
I just heard that Quilter has raised $25M in Series B Funding -- remember that you read about them here first (https://www.linkedin.com/posts/sergiynesterenko_weve-raised-a-25-m-series-b-led-by-index-activity-7381434482610012160-a69i/)
Posted on Sep 29 at 10:52am by Ryan @ Sundance
Great write up and explanation! There is room for a lot of OpenVPX hardware solutions to become optimized/expanded into these smaller formfactors. It is certainly interesting seeing how much compute can be pushed to the edge! The standard offers "fewer" slot profiles and combinations than OpenVPX did and SOSA ...
Posted on Sep 29 at 4:21am by ETION
Etion Create (https://etioncreate.co.za/products/) is leveraging the current knowledge in OpenVPX standards to provide a high reliability small form factor solution in the VNX+ format. The ETION Cheetah Tactical Router provides a VNX+ platform to survive military environments with 71degC operational temperatures. The SWAP-C requirement also forces ...
Posted on Sep 25 at 8:31am by Max Maxfield
A friend we'll call Adam (because that's his name) asked me: "Do these resonators still need the capacitive loading, or can that come off the board too?" I asked Eric at SiTime, who responded as follows: "The load capacitances are on-chip in 90% + of wireless SoCs and 32-bit ARM Cortex M ...
Posted on Sep 24 at 12:05pm by Max Maxfield
I passed your question on to SiTime. I just heard from Eric Garlepp, Sr. Director of Product Marketing | IoT, Mobile & Consumer. Eric says: "For our current standard CSP package, the nominal height is 0.46mm and the max height is 0.5mm. For co-packaging with other chips, we sell wafers (Known Good ...
Posted on Sep 24 at 5:55am by Max Maxfield
I don't know -- I'll ask the folks from SiTime to respond to your question.
Posted on Sep 24 at 5:12am by amond@ecmstockroom.com
What is the overall Height of the resonator?
Posted on Sep 16 at 9:40am by Max Maxfield
Thanks Flemming -- FYI I wrote a column on Zero ASIC's chiplet stuff: Is This the Future of Chiplet-Based Design? (https://www.eejournal.com/article/is-this-the-future-of-chiplet-based-design/). Also, although not 100% applicable here, Steve Leibson did a column on their open eFPGA IP: Is the world ready for Platypus, Zero ASIC’s ...
Posted on Sep 16 at 8:59am by Flemming.C@Sundance.com
Its’ true. The current high-end x86 CPUs and, even worse, the GPUs, take lots of power, as they are not targeted for embedded solutions. VITA90 (VNX+) is for small-form-factor solutions now Who picked the name “VNX+”, as not an upgrade to “VNX”?? Can somebody find the culprit, please? However, VITA90...
Posted on Sep 16 at 3:21am by ThomasPaine
Thermal designs handling 90W+ per VNX+ module are already out there. Cooling experts like EngineeringEntropy.co.uk are moving that limit all the time. Most modules in VNX+ target applications will need nothing like that amount of power, but well designed cooling also reduces wear and tear on devices. Extending ...
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featured blogs
Oct 7, 2025
I hate scammers. I wish I had the skills to track them to their lairs and give them a very 'bad hair day' indeed....
Veloce proFPGA CS First to Market with VP1902
In this episode of Chalk Talk, Oz Levia from Siemens and Amelia Dalton explore the trends pushing a need for hardware-assisted verification, how modularity can speed up system design, and the benefits that the Veloce proFPGA CS platform can bring to your next design.
Oct 7, 2025
1,575 views
Designing for R-290: Overcoming HVAC Component Challenges
In this episode of Chalk Talk, Paul Kramarz from Littelfuse and Amelia Dalton explore the what, where and how of R-290. They investigate the testing methods utilized for this kind of refrigerant and how Littelfuse is further innovation in this arena.
Oct 2, 2025
9,224 views
CUBE: Powering the AI Revolution
Sponsored by Winbond
In this episode of Chalk Talk, Omar Ma from Winbond and Amelia Dalton explore how we can power the AI revolution with CUBE. They also investigate how AI model parameters compare with DRAM density, why green DRAM can be a great solution for edge AI applications and how the CUBE can be scaled for implementation in a wide variety of applications including AI acceleration, AR/VR, smart cameras and more.
Sep 25, 2025
19,209 views
Single Pair Ethernet
In this episode of Chalk Talk, Tim Kurten from Cinch Connectivity Solutions and Amelia Dalton explore the what, where and how of single pair ethernet and how this technology is changing the landscape of smart building and industrial applications. They also investigate the different types of single pair ethernet and the benefits of Cinch Connectivity solutions in this arena.
Sep 23, 2025
20,413 views
Simplifying High Speed Interface Connections with Hirose’s AU1
Sponsored by Mouser Electronics and Hirose
In this episode of Chalk Talk, Nathan Moskal from Hirose and Amelia Dalton explore the benefits of Hirose’s AU1 connector and robust automotive features included in this solution. They also investigate how connector position assurance of this solution can assist with mis-mating and the variety of applications that can take advantage of AU1 connectors.
Sep 18, 2025
27,013 views
Accelerating BLDC Innovation Without the Complexity
Sponsored by Mouser Electronics and Qorvo
In this episode of Chalk Talk, Ryan Scott from Qorvo and Amelia Dalton investigate how we can accelerate brushless DC innovation without complexity. They also discuss the trends behind the adoption of brushless DC motors, the challenges inherent in their design, and how Qorvo can help you streamline the journey from concept to production for your next brushless DC motor design. 
Sep 18, 2025
28,592 views