When Safety is King, NAND Reigns Supreme

In this week’s episode of Fish Fry, we investigate the changing role of NAND flash in safety-based systems. Dave Hughes (CEO – HCC Embedded) joins us to discuss HCC’s “Safety Element out of Context” embedded software approach and how HCC helping engineers better use NAND flash in safety systems. Also this week, we give everyone another chance to win a “Hitchhiker’s Guide … Read More → "When Safety is King, NAND Reigns Supreme"

Microsemi Joins RISC-V Love Fest with SoC FPGA

Processors and FPGAs go together like chocolate and peanut butter, but it took a few years to get the recipe just right. Early turn-of-the-millennium attempts included the Xilinx Virtex II Pro with an on-chip PowerPC processor core and Altera’s Excalibur device with an ARM922T processor core. These early products are considered market failures. Actually, Kevin Morris called the Altera Excalibur “a monumental flop” in his article titled “< … Read More → "Microsemi Joins RISC-V Love Fest with SoC FPGA"

RISC-V: The Groundswell Continues

“Faith is taking the first step even when you don’t see the whole staircase.” – Martin Luther King, Jr.

It’s interesting to attend a religious revival meeting when you’re not a member of that particular denomination. It’s a bit like attending a political rally as an outsider, or buying tickets to a live concert even though you hate the band but your … Read More → "RISC-V: The Groundswell Continues"

Who Chooses Components and Tools?

Before becoming professional engineers, most of us designed and built things as a hobby. It’s rare to find an engineer who jumped right into engineering school without at least some background of tinkering and experimenting. And, when we did those projects, we had full control. We could choose whatever part we wanted or needed. We didn’t have to deal with management, manufacturing, … Read More → "Who Chooses Components and Tools?"

December 17, 2018
December 14, 2018
December 13, 2018
December 12, 2018
December 11, 2018
December 10, 2018
December 7, 2018
December 6, 2018
December 5, 2018
December 4, 2018
December 3, 2018
discussion
Posted on Dec 17 at 9:41am by Bryon Moyer
What do you think of OneSpin's take on formal coverage?
Posted on Dec 14 at 1:08am by Kev
There would be somewhat more value in RISC-V if it was something more than just the latest rev of an old idea, but done cheaper. In the pictures above it could be a number of CPUs in the "RISC-V" boxes, and it would work just the same - most of ...
Posted on Dec 13 at 6:54am by Karl Stevens
Yes indeed, there is not a dimes worth of difference between ALL of the RISC ISAs. There is a load instruction for each operand, a store for the result, and a fetch of the instruction that does the operation. The actual performance is determined by the memory system. Caches supposedly ...
Posted on Dec 10 at 10:13am by Bryon Moyer
What do you think of HCC Embedded's failsafe flash management?
Posted on Dec 3 at 12:35pm by Bryon Moyer
What do you think of Boréas's approach to haptics using piezoelectric materials?
Posted on Nov 30 at 12:27am by Kev
The Load/Store times are somewhat misleading, high-density memories on the end of serial links (PCIe) are not that fast on small transfers. If you want that speed you'll have to do PiM - die-stacking the memory with CPU. Likewise using a single cache-coherent data-bus becomes the throttle on the ...
Posted on Nov 28 at 3:04pm by Kevin Morris
I'm on the other side of this. For example, if I'm using a $5 IoT device to do something important, and that device has $40M worth of cloud data center support required to make it work properly, I'd rather be paying for the service than the object. I want the supplier ...
Posted on Nov 28 at 8:50am by Jim Turley
[cranky mode /on] Personally, I don't like subscriptions *at all.* When I buy something, I want to buy it, not keep paying for it. I pay cash for cars. I'd pay cash for my house if I could. I bought a cable modem rather than rent one from my ISP. ...
Posted on Nov 26 at 9:29am by Bryon Moyer
What do you think, either specifically about GTS's battery-as-a-service offering, or about the general trend away from owning things?
Posted on Nov 23 at 11:00am by Karl Stevens
Hi, Bryon. I am a system and hardware designer new to AI. You wrote: "You’re going to be working with smaller data units. The big data loads consist of the weights or coefficients for the nodes of the network and for what they call the activation – the input data (...
Subscribe Now

featured blogs
Dec 17, 2018
If row-based placement is a topic that interests you, you might have read our post from the last week . If you haven'€™t read it yet, I'€™d highly recommend it for its focus on the need and benefits of... [[ Click on the title to access the full blog on the Cadence Commu...
Dec 13, 2018
In November, we continued our mobile updates to the website, released a couple of new content experiences, and made placing sample requests even easier. Read more below on these and the rest of the major updates to Samtec.com for November 2018. Continued Improvements to our M...
Dec 12, 2018
The possibilities for IoT devices, much like the internet itself, are endless. But with all of those possibilities comes risks....
Nov 14, 2018
  People of a certain age, who mindfully lived through the early microcomputer revolution during the first half of the 1970s, know about Bill Godbout. He was that guy who sent out crudely photocopied parts catalogs for all kinds of electronic components, sold from a Quon...
chalk talks
RedFit IDC SKEDD Connector — Wurth Electronics and Mouser Electronics  Why attach a header connector to your PCB when you really don’t need one? If you’re plugging a ribbon cable into your board, particularly for a limited-use function such as provisioning, diagnostics, or testing, it can be costly and clunky to add a header connector to your BOM, and introduce yet another component to … Read More → "RedFit IDC SKEDD Connector — Wurth Electronics and Mouser Electronics"
RedExpert — Wurth Electronics and Mouser Electronics  Choosing the right passive for your design can be a maddening voyage through datasheets, internet searches, and endless matching and comparing of component specs. Finding just the right inductor or capacitor often becomes an exercise in drudgery. In this episode of Chalk Talk, Amelia Dalton chats with Hebberly Ahatlan of Wurth Electronics about RedExpert … Read More → "RedExpert — Wurth Electronics and Mouser Electronics"
What is Intel® Optane™ Technology? — Mouser Electronics and Intel  Memory architecture is often the biggest bottleneck in a high-performance system design. The gap between high-speed DRAM and higher-capacity non-volatile memory sits at an inconvenient place on the cost-performance curve. In this episode of Chalk Talk, Amelia Dalton chats with Jeffrey Galinovsky of Intel about how new Intel technologies including Intel® Optane™ memory technology … Read More → "What is Intel® Optane™ Technology? — Mouser Electronics and Intel"
Building Application Designs with Pressure Sensors — Honeywell and Mouser Electronics   Today’s IoT designs require a large variety of sensors, and finding the correct one can be a daunting challenge. Choosing wisely could affect just about every aspect of your project, from BOM cost to performance in the field.  In this episode of Chalk Talk, Amelia Dalton chats in depth with Clint Briscoe of … Read More → "Building Application Designs with Pressure Sensors — Honeywell and Mouser Electronics"
Accelerating a Smart and Connected World — Intel and Mouser Electronics   With the rapid pace of change in IoT designs these days, the flexibility, power efficiency, and low latency of FPGAs can be major advantages. In this episode of Chalk Talk, Amelia Dalton chats with Tom Schulte of Intel about applying FPGA technology to IoT systems. Click here for more information about Intel® FPGAs (formerly … Read More → "Accelerating a Smart and Connected World — Intel and Mouser Electronics"
A New Advanced IC Packaging Battlefield  Today, advanced packaging technology has created a new battleground where 2.5D packaging and heterogeneous design drive constraints that span semiconductor, packaging, board, and even system-level design. In this episode of Chalk Talk, Amelia Dalton chats with John Park of Cadence Design Systems about new techniques and tools for advanced IC packaging design. Click here … Read More → "A New Advanced IC Packaging Battlefield"